The 13th Global Conference on Polymer and Composite Materials (PCM 2026)

Abstract: With the advent of the 5G era, new-generation electronic devices are developing toward miniaturization, integration and intelligence, which further increases the heat generation efficiency of equipment and seriously threatens the working performance and service life of electronic devices. Thermal management materials are the key materials to solve the heat dissipation problem in modern electronic packaging technology. The team has carried out a series of research work on the development and application of advanced thermal management materials:
1. Constructing lightweight and efficient heat transfer structures via advanced methods such as chemical in-situ conversion;
2. Loading nucleating agents on the heat transfer structures to synergistically improve the supercooling resistance and leakage-proof performance of phase change materials;
3. Developing the "heat conduction-storage integrated" thermal management materials with high thermal conductivity, high enthalpy, excellent leakage resistance and cycling stability;
4. Exploring the application of the self-developed modules containing the "heat conduction-storage integrated" thermal management materials in the thermal management of instantaneous high-power chips.

Keywords
Thermal Management Materials, Phase Change Composites, Thermal Conductivity, Heat Storage High-power Chips

Biography: Professor Yanhui Chen is currently a Professor and PhD Supervisor at the School of Chemistry and Chemical Engineering, Northwestern Polytechnical University (NWPU), China, and a recipient of the National Young Talent Program. She received her B.S. degree in Polymer Materials and Engineering from the College of Polymer Science and Engineering, Sichuan University in 2008, and her Ph.D. in Materials Processing Engineering from the same institution in 2013 under the supervision of Prof. Zhongming Li (National Science Fund for Distinguished Young Scholars & Changjiang Scholar). From November 2011 to November 2013, she conducted joint Ph.D. research as a visiting scholar in the group of Prof. Benjamin S. Hsiao, a world-renowned polymer physicist, at the Department of Chemistry, State University of New York at Stony Brook, supported by the China Scholarship Council (CSC) Program. Since 2014, She worked at the School of Chemistry and Chemical Engineering, Northwestern Polytechnical University (NWPU), China.
Her research focuses on the design, fabrication and application of advanced functional materials for thermal management, especially heat conduction-storage integrated composites for high-power electronic devices. She has led over 18 national and provincial research projects in this field, published over 60 papers in peer-reviewed international journals, like Advanced Materials, ACS Nano, Composites Science and Technology, and applied/issued 17 Chinese Patents. She also has some social academic positions: Member of the First Committee of the Micro-Nano System Thermal Management Branch of the Chinese Micron Nanotechnology Society (January 31, 2026 - January 31, 2031), Member of the First Committee of the Polymer and Polymer Engineering Professional Committee of the Chinese Chemical Society (December 2024 - December 2029), Member of the First Committee of the Electronic Chemicals Professional Committee of the Chinese Chemical Society (February 2023 - February 2028) and Member of the 41st Council of the Chinese Chemical Society (November 2022 - November 2027)。